Quick Verdict
A highly specialized embedded Tiger Lake variant that trades GPU power and clock speed for ECC memory support and long-term supply guarantees, serving a vital niche outside of consumer electronics.
Overview
Launch
2020
Status
ActiveGeneration
11th Generation
Market
Mobile
The Intel Core i3-1115GRE is a 2-core, 4-thread embedded mobile processor featuring rare ECC memory support, a reduced 48EU integrated GPU, and an IPU 6.0, designed for ruggedized and industrial computing environments.
The Core i3-1115GRE is tailored for the embedded market, distinguished by its support for ECC memory—a rarity in mobile chips. It features 2 Willow Cove cores at 2.2 GHz base and 3.
9 GHz boost, 6MB of L3 cache, and includes the IPU 6.0. Notably, its integrated graphics are labeled as UHD Graphics G4 48EU, indicating a harvested die with fewer execution units than the standard Iris Xe.
Specifications
Performance
Adequate for running single-purpose industrial applications, HMIs, or signage software. The 2 cores are sufficient for dedicated tasks.
Not designed for virtualization. 2 cores and 15W TDP limit VM utility.
The 48EU GPU is further reduced from the already cut-down G4 tier. Gaming is not a consideration for this chip.
Excellent efficiency for embedded use cases. The 12W cTDP down option allows fanless operation in sealed industrial enclosures.
- •48EU GPU is harvested/disabled silicon
- •Not intended for any graphical workloads beyond display output
- •Cannot handle modern 3D applications
- •IPU 6.0 can be utilized for edge AI vision tasks in industrial settings
- •Lacks a modern NPU for broad AI inference
- •AVX-512 provides CPU vector math acceleration
Architecture
10nm (SuperFin)
Process Node
Tiger Lake-U
Codename
2C / 4T
Core Config
6 MB
L3 Cache
15 W
TDP
Architecture Overview
This is a binned Tiger Lake-U die tailored for the embedded market, featuring disabled GPU Execution Units and enabled ECC memory controllers.
CPU Design
2 Willow Cove cores with Hyper-Threading. The boost clock is slightly reduced to 3.9 GHz (from 4.1 GHz on consumer variants), likely to improve yield and ensure stable operation across wider temperature ranges.
Memory Subsystem
Dual-channel DDR4-3200 or LPDDR4X-3733 with ECC support enabled. This is the defining feature, requiring specific memory modules and BIOS support.
PCIe & I/O
4 direct PCIe 4.0 lanes, with VMD (Volume Management Device) support mentioned in the features list for enterprise storage management.
Overclocking
Locked multiplier.
- Willow Cove architecture provides major IPC gains
- Xe-LP GPU architecture replaces UHD Graphics
- Addition of IPU 6.0
- PCIe 4.0 support
- ECC memory support retained and improved
Key Highlights
- Rare ECC memory support in a mobile form factor
- Guaranteed long-term embedded lifecycle
- IPU 6.0 for machine vision and scanning
- Low 12W cTDP down for fanless designs
- VMD support for enterprise storage
- Very high $338 launch price for a 2-core chip
- Reduced 48EU GPU limits display and graphics capabilities
- Lower 3.9 GHz boost compared to consumer 1115G4
- Only 4 CPU PCIe lanes
- Not available through retail channels
History
The Core i3-1115GRE represents Intel's commitment to providing cutting-edge architecture to the embedded sector, albeit with strict segmentation to protect consumer pricing. Launched alongside the standard Tiger Lake mobile lineup in September 2020, the 'GRE' variant was engineered for a completely different audience than the typical laptop buyer.</br></br>Industrial computing has unique requirements.
Devices like factory HMIs, medical carts, and digital signage players often run 24/7 in environments with dust, vibration, or high ambient temperatures. They require ECC memory to prevent silent data corruption, and they need a guaranteed supply of components for 7 to 10 years to avoid recertifying hardware designs.</br></br>To create the 1115GRE, Intel took Tiger Lake dies that didn't pass validation for the full 80EU Iris Xe GPU, disabled the faulty execution units to yield a 48EU 'UHD Graphics' part, and enabled the ECC memory paths on the die.
The clocks were slightly reduced to 3.9 GHz to ensure stability across the extended temperature ranges required by embedded specifications. At $338, it carried a significant premium over consumer parts, reflecting the cost of this specialized validation and the long-term supply chain commitment.
Improvements over Previous Generation
- Willow Cove architecture provides major IPC gains
- Xe-LP GPU architecture replaces UHD Graphics
- Addition of IPU 6.0
- PCIe 4.0 support
- ECC memory support retained and improved
Alternatives & Competitors
Should You Buy It?
Not Recommended for the right buyer
Designing an industrial tablet, medical device, or digital signage player that specifically requires mobile ECC memory support.
Avoid if…
- Building any consumer-facing device
- You do not explicitly need ECC memory
- Cost is a primary concern (embedded SKUs carry a premium)
Use Cases
Interesting Facts
At $338, it launched at a $57 premium over the standard 1115G4, reflecting the cost of validating and supporting ECC memory.
The 'R' in 'GRE' stands for a specific embedded bin, distinct from the standard 'G4' mobile parts.
Despite the source listing 'Iris Xe Graphics dynamic frequency: 1250 MHz' in features, the core config specifies 'UHD Graphics G4 48EU', indicating a harvested die.
ECC memory on mobile platforms is exceptionally rare because most mobile chipsets and BIOSes do not support the necessary memory scrubbing logic.
It supports Intel VMD, typically used for NVMe RAID arrays in servers, pointing to its enterprise storage potential.
The 3.9 GHz boost is 200 MHz lower than the consumer 1115G4, a common tactic to increase silicon yield for embedded parts that must operate reliably 24/7.
Part number SRK13 is exclusive to this embedded variant.
The IPU 6.0 in this chip can be repurposed by OEMs for industrial machine vision tasks, not just webcams.
Intel guarantees these embedded parts for 7+ years, a stark contrast to the 18-month lifecycle of consumer chips.
It is one of the few Tiger Lake parts to explicitly list 'Embedded segment' in its feature set.
People Also Ask
What does the 'R' mean in Intel Core i3-1115GRE?
The 'R' designates it as a specialized embedded bin, often indicating specific feature unlocks like ECC memory support and a guaranteed long-term supply lifecycle.
Does the i3-1115GRE support ECC memory?
Yes, it is one of the rare 11th-gen mobile processors that supports Error-Correcting Code memory.
Why does the i3-1115GRE have UHD Graphics instead of Iris Xe?
It features a harvested Tiger Lake die with disabled Execution Units (48EU instead of 80EU), which Intel markets under the UHD Graphics name for binning purposes.
What is the IPU used for in an embedded context?
Beyond webcams, the IPU 6.0 can be utilized by OEMs for industrial machine vision, barcode scanning, and edge AI image processing.
Why is the boost clock lower than the standard 1115G4?
The 3.9 GHz boost (vs 4.1 GHz) is a result of binning for reliability. Embedded chips must operate flawlessly 24/7 in harsh environments, so conservative clock limits are applied.
Can I buy the i3-1115GRE for a custom laptop?
No, it is sold exclusively through Intel's embedded distribution channels to OEMs and industrial customers.
Does it support VMD?
Yes, Intel Volume Management Device (VMD) is supported, allowing for NVMe RAID configurations.
What is the launch price of the i3-1115GRE?
$338.
How many PCIe lanes does it have?
4 direct PCIe 4.0 lanes from the CPU.
What is the part number?
SRK13.
Frequently Asked Questions
What is the L3 cache size?
6 MB.
Does it support DDR5?
No, DDR4 and LPDDR4X only.
What is the max turbo power?
52W.
Is the multiplier unlocked?
No.
What is the dynamic GPU frequency?
1250 MHz.
Does it support AVX-512?
Yes.
What socket does it use?
BGA 1449.
Is it still in production?
Yes, listed as Active, which is typical for embedded parts with long lifecycles.
What is the configurable TDP down?
12W.
When was it released?
September 2, 2020.