ActiveUltra 5 (Lunar Lake)

Intel · Core Ultra 5

Intel Core Ultra 5 236V

Efficiency redefined with on-package memory and 40 TOPS NPU for next-gen ultraportables.

Thin and Light LaptopsOffice ProductivityCasual GamingAI AccelerationMedia Consumption

Cores / Threads

8/ 8

Base / Boost

2.1/ 4.7 GHz

PCIe Lanes

4

L3 Cache

8MB

TDP

17W

Socket

Intel BGA 2833

Verdict

8.8/ 10

88

Quick Verdict

A highly efficient processor that brings excellent battery life and integrated AI capabilities to premium ultraportables, though the fixed 16GB RAM might be a limitation for some power users.

Best for:Thin and Light LaptopsOffice ProductivityCasual GamingAI AccelerationMedia Consumption

Overview

Launch

Sep 24th, 2024

Status

Active

Generation

Ultra 5 (Lunar Lake)

Market

Mobile

About this CPU

The Intel Core Ultra 5 236V represents a significant shift in Intel's mobile processor strategy, introducing the Lunar Lake architecture. Launched in September 2024, this mobile chip integrates 4 performance cores and 4 efficiency cores, operating at a base frequency of 2.1 GHz with a maximum turbo boost of 4.7 GHz. What sets this processor apart is its use of TSMC's 3nm manufacturing process for the compute tile, delivering exceptional power efficiency. It features on-package LPDDR5x memory running at 8533 MT/s, available in a 16GB configuration, which reduces latency and saves physical motherboard space. Additionally, the integrated Arc 130V graphics and a dedicated NPU capable of 40 TOPS make it highly competent for modern AI workloads and casual gaming. With a modest 17W base TDP and a maximum power draw of 37W, it is engineered specifically for thin-and-light laptops where battery life and sustained performance are equally crucial. This marks a pivotal moment for Intel's competitive standing in the premium ultraportable segment.

The Core Ultra 5 236V introduces Intel's Lunar Lake architecture, utilizing TSMC's 3nm process to deliver outstanding power efficiency. With 4 P-cores and 4 E-cores, it operates at 2.1 GHz base and 4.

7 GHz boost clocks. The processor uniquely integrates 16GB of LPDDR5x memory directly on the package, running at 8533 MT/s, which significantly lowers latency and power consumption. It also features Arc 130V integrated graphics and a 40 TOPS NPU, making it highly capable for everyday productivity, casual gaming, and AI-accelerated tasks.

Its 17W base TDP ensures long battery life, making it an ideal choice for premium ultraportable laptops where efficiency and mobility are paramount.

Specifications

ArchitectureLunar Lake
Manufacturing ProcessTSMC 3nm
Cores / Threads8 / 8
Base Clock2.1 GHz
Boost Clock4.7 GHz
L3 Cache8 MB
TDP17 W
Memory TypeLPDDR5x (On-package)
Memory Speed8533 MT/s
Memory ChannelsDual-Channel (2)
Max Memory16 GB
PCIe Version / LanesPCIe 5.0 × 4
Integrated GraphicsYes
Dual-Channel4 PCIe Lanes
Target Audience
GamersStreamersContent CreatorsDevelopersWorkstation UsersOffice UsersStudents

Performance

Productivity
88Very Good

Extremely responsive for everyday office tasks, multitasking, and web browsing.

Virtualization
70Good

Can handle light virtualization, but the limited 16GB RAM restricts running multiple heavy VMs.

Gaming
75Good

Capable of running esports and older titles at 1080p, but not suited for demanding AAA games.

Efficiency
98Excellent

Industry-leading efficiency thanks to the 3nm process and on-package memory design.

GamingGood
  • Arc 130V graphics offer solid 1080p performance in older titles
  • Supports hardware ray tracing
  • Not intended for high-refresh-rate AAA gaming
CreatorModerate
Light Photo EditingBasic 1080p Video EditingAudio Production
AI / MLExcellent
  • 40 TOPS NPU enables local AI processing
  • Meets Copilot+ PC standards
  • Efficiently handles background AI blur and noise cancellation
Industry Impact
Gaming
Moderate
Workstations
Low
Content Creation
Moderate
Virtualization
Low

Architecture

TSMC 3nm

Process Node

Lunar Lake

Codename

8C / 8T

Core Config

8 MB

L3 Cache

17 W

TDP

Architecture Overview

The architecture of the Core Ultra 5 236V is defined by the Lunar Lake design, utilizing a disaggregated chiplet approach despite its compact mobile footprint. The compute tile is manufactured on TSMC's advanced N3B 3nm process, housing next-generation "Lion Cove" P-cores and "Skymont" E-cores. This combination removes Hyper-Threading, relying instead on physical cores to maximize performance per watt and mitigate security vulnerabilities associated with SMT. The processor includes a substantial cache hierarchy, featuring 2.5MB of L2 cache per P-core and 4MB of L2 cache per E-core module, alongside an 8MB shared L3 cache. Memory is directly packaged on the substrate using LPDDR5x at 8533 MT/s, drastically cutting memory latency and power consumption compared to traditional DIMM setups. Furthermore, the integrated Arc 130V graphics leverages the Xe2 architecture, providing a notable leap in iGPU performance. The NPU delivers 40 TOPS, accelerating background AI tasks efficiently without draining the battery. This makes the architecture highly forward-looking.

CPU Design

Features 4 Lion Cove P-cores and 4 Skymont E-cores without Hyper-Threading.

Memory Subsystem

Utilizes on-package LPDDR5x memory operating at 8533 MT/s.

PCIe & I/O

Includes 4 PCIe 5.0 lanes directly from the CPU and 4 secondary PCIe 4.0 lanes.

Overclocking

The multiplier is locked, prioritizing power efficiency over manual tuning.

Generation Comparison
Intel Core Ultra 5 125UIntel Core Ultra 5 236V
  • Transition to TSMC 3nm process
  • On-package memory for lower latency
  • Removal of Hyper-Threading for better efficiency
  • Significantly faster NPU (40 TOPS vs 11 TOPS)

Key Highlights

On-Package Memory
Integrates 16GB of LPDDR5x memory directly onto the CPU substrate for reduced latency and power consumption.
40 TOPS NPU
Features a dedicated Neural Processing Unit capable of 40 TOPS, meeting Microsoft Copilot+ PC requirements.
TSMC 3nm Process
Utilizes TSMC's advanced 3nm manufacturing node for the compute tile, ensuring exceptional energy efficiency.
Xe2 Arc Graphics
Includes Arc 130V graphics based on the new Xe2 architecture, providing a significant boost in integrated GPU performance.
Strengths
  • Industry-leading power efficiency
  • On-package memory reduces latency
  • 40 TOPS NPU for Copilot+ AI features
  • Strong integrated Arc 130V graphics
  • Silent operation in fanless designs
Weaknesses
  • Memory is capped at 16GB and cannot be upgraded
  • No Hyper-Threading limits multi-threaded scaling
  • Only 4 PCIe 5.0 lanes available
  • Locked multiplier prevents overclocking

History

Launch Date
Sep 24th, 2024
Status
Active
Generation
Ultra 5 (Lunar Lake)
Market
Mobile
The Story

The history of the Core Ultra 5 236V is tied to Intel's urgent need to regain competitiveness in the power-efficient mobile market, a sector heavily dominated by Apple's M-series and Qualcomm's Snapdragon X processors. Announced and launched in September 2024, Lunar Lake represented a departure from Intel's traditional in-house manufacturing reliance, utilizing external foundry TSMC for the critical 3nm compute node. This strategic pivot allowed Intel to bypass delays in their own manufacturing nodes and deliver a highly efficient chip rapidly.

The 236V specifically targeted the premium thin-and-light category, offering a fixed 16GB of on-package memory to streamline laptop design and power usage. The inclusion of a 40 TOPS NPU also aligned with the industry-wide push towards AI PCs, meeting Microsoft's Copilot+ requirements. This processor symbolizes Intel's transitional phase, bridging the gap towards future Panther Lake architectures while establishing a new baseline for battery life and integrated performance in Windows ultrabooks.

Improvements over Previous Generation

  • Transition to TSMC 3nm process
  • On-package memory for lower latency
  • Removal of Hyper-Threading for better efficiency
  • Significantly faster NPU (40 TOPS vs 11 TOPS)

Alternatives & Competitors

Core Ultra 5 228V
Offers 32GB of memory for users needing more RAM capacity.
Core Ultra 7 268V
Better performance and more graphics execution units for slightly higher budgets.
AMD Ryzen 7 8840U
A traditional x86 alternative with upgradeable memory configurations.
Apple MacBook Air M2
A strong alternative for users within the Apple ecosystem.
Snapdragon X Plus
A highly efficient ARM-based alternative for Windows on ARM.
Direct Competitors
AMD Ryzen AI 9 365Qualcomm Snapdragon X EliteApple M3Intel Core Ultra 7 258VAMD Ryzen 7 8840U

Should You Buy It?

Recommended for the right buyer

Premium thin-and-light laptop for all-day battery life

Avoid if…

  • You require more than 16GB of RAM
  • You need heavy multi-threaded rendering performance
  • You want to play demanding AAA games at high settings

Use Cases

Office Productivity
Excellent
Web Browsing
Excellent
4K Media Playback
Excellent
Casual Gaming
Very Good
AI Background Tasks
Very Good

Interesting Facts

The Core Ultra 5 236V uses TSMC's 3nm process, marking a rare instance of Intel using a direct competitor's leading-edge node for a core product.

It is one of the first Intel processors to completely remove Hyper-Threading in favor of physical cores only.

The memory is physically attached to the CPU package, similar to Apple's M-series chips, to reduce latency.

It features the "Lion Cove" P-core architecture, which represents a significant redesign over previous generations.

The integrated Arc 130V graphics use the new Xe2 architecture, offering a massive leap in iGPU performance.

Despite being a 17W chip, it can boost up to 37W for short bursts to handle heavy single-threaded tasks.

The NPU delivers 40 TOPS, making it fully compliant with Microsoft's Copilot+ PC standards.

It only has 4 PCIe Gen 5 lanes directly from the CPU, limiting external expansion to mainly storage or specific peripherals.

The chip integrates both the compute and platform controller hub (PCH) into a single package, simplifying motherboard design.

Lunar Lake was originally rumored to be a limited release but became Intel's flagship mobile efficiency architecture.

People Also Ask

Is the Core Ultra 5 236V good for gaming?

It is capable of casual and light gaming thanks to the Arc 130V graphics, but not intended for high-end AAA gaming.

What is the difference between Core Ultra 5 236V and 228V?

The 236V has a higher turbo boost (4.7 GHz vs 4.5 GHz) and comes with 16GB of memory, whereas the 228V is available with 32GB.

Can the Core Ultra 5 236V run video editing software?

Yes, it can handle light to moderate 4K video editing, though heavy renders will be slower than on higher-wattage CPUs.

Does the Core Ultra 5 236V have an NPU?

Yes, it includes an NPU capable of 40 TOPS for AI acceleration.

What socket does the Core Ultra 5 236V use?

It uses the Intel BGA 2833 socket, meaning it is soldered directly to the motherboard.

How does the Core Ultra 5 236V compare to Apple's M3?

It offers competitive CPU efficiency and stronger AI capabilities, though Apple still holds an edge in certain sustained workloads.

Is the Core Ultra 5 236V fanless?

Laptops featuring this chip can be designed to be fanless due to its low 17W TDP, though some may include small fans.

What are P-cores and E-cores in the Core Ultra 5 236V?

It has 4 Performance cores (Lion Cove) for demanding tasks and 4 Efficiency cores (Skymont) for background processes.

Does the Core Ultra 5 236V support Thunderbolt?

Yes, Lunar Lake processors support Thunderbolt 4 via the integrated SOC.

What is the L3 cache size of the Core Ultra 5 236V?

It has an 8 MB shared L3 cache.

Frequently Asked Questions

Does the Intel Core Ultra 5 236V support Hyper-Threading?

No, Lunar Lake processors do not feature Hyper-Threading, relying purely on physical cores.

Can I upgrade the RAM on a laptop with the Core Ultra 5 236V?

No, the 16GB of LPDDR5x memory is packaged directly onto the CPU substrate and cannot be upgraded.

What is the maximum turbo frequency of the Core Ultra 5 236V?

It can boost up to 4.7 GHz on its performance cores.

Does the Core Ultra 5 236V meet the requirements for Copilot+ PCs?

Yes, with its 40 TOPS NPU, it exceeds the 40 TOPS requirement for Microsoft Copilot+ features.

What graphics are integrated into the Core Ultra 5 236V?

It features Intel Arc 130V graphics based on the Xe2 architecture.

What is the base TDP of the Core Ultra 5 236V?

The base TDP is 17 Watts, with a maximum power draw of 37 Watts.

What manufacturing process is used for the Core Ultra 5 236V?

The compute tile is manufactured using TSMC's 3nm process.

How many cores and threads does the Core Ultra 5 236V have?

It has 8 cores (4 P-cores and 4 E-cores) and 8 threads.

Is the Core Ultra 5 236V unlocked for overclocking?

No, the multiplier is locked, and it is not designed for overclocking.

What type of memory does the Core Ultra 5 236V support?

It exclusively uses on-package LPDDR5x memory running at 8533 MT/s.